Bond Test Overview
Visual Test and Inspection
Visual techniques using Automated Optical Inspection equipment are used to verify that proper Ball Bonds and Wedge Bonds have been formed according to process design. In addition, the Visual Test and Inspection process also verifies that the bonds have been properly located in relation to the bond pads and the fingers of the leadframe and/or substrate.
Die Shear Tests can be performed with a few grams of force up to 1000 kilograms of force. Die Shear Tests are also suitable for Ultra Thin Dies and Flip Chip Ball Grid Arrays.Our self aligning Die Shear Tools can help eliminate issues with cracked dies during test.